Background Semiconductor manufacturers have extremely high requirements on power supply, in particular the wafer related industry with higher requirements on power supply quality. Once voltage transient drop occurs, it will not only cause unexpected damage to sensitive microcomputer automatic control devices but also interrupt the process and cause great losses. To protect sensitive devices from voltage transient drop damage, the SEMI F47 standard stipulates the tolerance level of the semiconductor processing equipment on voltage transient drop, and requires that the semiconductor processing equipment should be immune to voltage transient drop in the AC power grid.

Information age, the reliability of power supply is increasingly required. Especially in some key applications, such as data centers, communication base stations, etc., the stability of the power supply is directly related to the normal operation of the entire system.

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Traditional power supply testing requires engineers to manually set the parameters of the DC electronic load for pull-load testing, manually record the output parameters of the power supply under different load conditions, and then the operator to judge whether the power supply is qualified according to the standard, which is extremely inefficient and seriously affects the engineer's test verification and product delivery cycle. Moreover, when the traditional electronic load measures the ripple of the switching power supply, it is necessary to use an oscilloscope and a current probe together, which is not only expensive, but also extremely complicated to connect.